Prelaminated inlays Combi HF+HF

HF+HF Combi inlays contain two different chips and two antennas:
- ISO/ IEC 14443 (MIFARE®, NTAG®)
- ISO/ IEC 15693 (ICODE®).
ISBC inlays are checked on each production stage. During quality checks the operability of each chip is tested. ISBC provides a UID database for inlays.
Antennas for inlays developed by ISBC are certified in an independent international Arsenal Testhouse laboratory.
The technology used by ISBC allows us to offer completely flat inlays guaranteeing no problems in the production and high quality finished products.
Inlay materials are selected for the best sintering in two-tower and single-tower laminators, at temperatures from 115 to 200 ° C.
Technical specification
Features | Options |
---|---|
Available chip modules |
ISO 14443: MIFARE® Ultralight C, Ultralight EV1, Classic 1K EV1, Plus SE 1K, Plus X 2K, Plus X 4K, Plus EV1 2K, Plus EV1 4K, DESFire EV2 8K. NTAG213, NTAG215, NTAG216 JCOP ISO 15693: I-Code® SLIX2 |
Type of inlay | Prelaminated |
Thickness of inlay |
0.2-0.5 mm (other upon request) |
Size of inlay | up to 650x500 mm |
Material | PVC, PET, PC |
Color of plastic |
White (other color upon request) |
Antenna size |
Rectangular - 28x14 mm Round - ø 25 mm |
Different layout format |
3x8, 3x7, 6x8, 6x7, 3x10, 6x10 (other upon request) |
Antenna type | Copper wire (D=0,1 mm) |
Packaging |
A3 size 100 sheets/pack A2 size 50 sheets/pack Collected inlay in the robust plastic package inside the carton box |
Example of application |
- Physical, logical access - Fare collection systems - Social cards - Club and Loyalty Cards |
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