Wirepad Dual-Interface Inlays

Inlays for dual-interface cards in compliance with standards:

  • contact ISO / IEC 7816;
  • contactless ISO / IEC 14443 (MIFARE®).

ISBC Dual Wirepad inlays allow you to make dual card combining the benefits of a contact microprocessor and convenience of a contactless interface, according to standards:

  • contact interface ISO / IEC 7816;
  • contactless interface ISO / IEC 14443 (MIFARE®).

These two interfaces share the same microprocessor chip, operating system and EEPROM. The chip of the dual interface inlays is embedded in an outer layer of PVC, PET or PC in the same position as in contact cards.

For dual-interface card assembly processes an anisotropic conductive hot melt film (for example tesa® ACF 8414) can be used in common assembly lines.

Mechanical incorporation of the module and connection of electrical interfaces can be performed in one step .

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Technical specification

Features Options
Type of inlay Open
Thickness of inlay Open ( 0.15 mm, 0.2 mm, 0.4 mm)
Prelaminated (0.2-0.5 mm)
(other upon request)
Size of inlay A2, A3+, A3, up to 650x500 mm
Material PVC, PET, PC
Color of plastic White
(other color upon request)
Antenna size ID-1, ID-1/2, customized
Antenna design Custom antenna design for better performance depending on IC specification.
Different layout format 3x8, 3x7, 6x8, 6x7, 3x10, 6x10
(other upon request)
Antenna type Copper wire (D=0,1 mm)
Packaging A3 size 100 sheets/pack
A2 size 50 sheets/pack
Collected inlay in the robust plastic package inside the carton box
Example of application - Bank card
- eID card
- Fare collection systems
- Combination of physical & logical access
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